Accelerator sensitivity to ultra-low stray magnetic fields

Stray magnetic fields are a serious consideration in the design CLIC. Measurements to characterise stray magnetic fields at CERN are presented and a mitigation technique for CLIC is discussed.

Issue 34
20 October, 2020

Cold diodes for the inner triplet circuit of the High Luminosity LHC

The cold diodes of the new triplet circuits will be installed in a dedicated cryostat in the LHC tunnel downstream of the triplet magnets and close to the LHC beam pipe.

Issue 34
20 October, 2020

The Virtual International Linac2020 Conference

World’s linear accelerator community got together in online event to discuss latest research results.

Issue 34
19 October, 2020

Phase 2 of Large Hadron Collider upgrade project launched in the UK

26M£ funding will be major contribution to high luminosity LHC

Issue 34
19 October, 2020

A report from EASISchool 3

The EASITrain fellows and 16 external participants attended EASISchool 3 at the CNR-SPIN research institute in Genoa, Italy.

Issue 34
15 October, 2020

Increased cryogenic power at LHC Point 4

At LHC Point 4, a refrigerator that cools helium from room temperature to 4.5 K (-268.65 °C) has undergone major improvements in preparation for the HL-LHC

Issue 35
14 October, 2020

Introducing the Future Circular Collider Innovation Study at FCC November Workshop (FCC NoW)

The upcoming FCC November Week includes the kickoff meeting of the recently approved EU Horizon 2020 project “Future Circular Collider Innovation Study” (FCCIS).

Issue 34
07 October, 2020

Novel Technology Concepts for a Plasma Accelerator Research Facility

EuPRAXIA project moves into its preparation phase

Issue 34
30 September, 2020

LS2 Report: All interconnections in the LHC have been closed

The DISMAC project is coming to an end: the last of the 1232 interconnections was closed in August and the cool-down of the machine will now begin

Issue 34
16 September, 2020

Installation of the TDIS unit for the High-Luminosity LHC

Nearly one year after the start of the assembly activities the first 3-module-device Target Dump Injection Segmented (TDIS) unit is ready to be installed.

Issue 33
24 July, 2020